BGA Chips 198PCS Custom JEDEC Trays Heat Proof MPPO Materials

May 16, 2025
667 views
Chat Now
BGA Chips 198PCS Custom JEDEC Trays Heat Proof MPPO Materials From wafer-level chips to system-in-package modules, we design JEDEC trays that match your product’s shape and stacking needs. JEDEC trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles. Providing a
Learn More →
Related Videos
Hiner-Pack at 2025 SEMICON CHINA
Exhibition Video
Apr 03, 2025