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Packing Wafer Die PC Bare Die Trays ESD Injection Moulding

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Apr 28, 2025
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# PC Bare Die Trays # ESD Bare Die Trays # ESD bare die tray
Packing Wafer Die PC Bare Die Trays ESD Injection Moulding Waffle Pack Chip Carriers Series Products Used For Packing Wafer Die Waffle pack compared with other method has many advantages, it can be placed not only very tiny components or parts, and the flexibility to match the lid and clip to raise product real ease of use, can satisfy the customer the different demand for samples and production loading respectively, at the same time can also be applied to automated
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Packing Wafer Die PC Bare Die Trays ESD Injection Moulding
Packing Wafer Die PC Bare Die Trays ESD Injection Moulding
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