JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity

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Jun 14, 2024
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Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray Optimize handling for QFN, BGA, and custom modules with JEDEC trays built precisely to your product specs. Application: 1. Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly, and testing. 2. R&D: Storing and testing new products in laboratories and R&D environments. 3. Logistics: Used in supply chain management to securely transport electronic components.
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