Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
Aug 12, 2024
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# Optoelectronic Devices Tray
# Black Chip ESD Packaging Tray
# QFN ESD Packaging Tray
ESD Black Chip Die BGA QFN Packaging Tray For Optoelectronic Devices Tray Antistatic electronic JEDEC trays are special plastic packaging materials that can effectively prevent the generation of static electricity and thus protect electronic products from static damage. JEDEC trays are also a common plastic packaging material used for packaging, transporting and displaying a variety of products, such as IC manufacturing, electronic parts, D-RAM, precision instruments, etc.
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