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| Price | Negotiable |
| MOQ | 20KG |
| Delivery Time | 3-8 working day |
| Brand | Easun |
| Place of Origin | China |
| Certification | Rosh, Reach |
| Model Number | ES214 |
| Packaging Details | 20KG/bag |
| Payment Terms | T/T |
| Supply Ability | 4000000 |
| Washable Property | 90 ℃ | Composition | Polyamide |
| Place of Origin | China | Melt Point(DSC) | 108-120 ℃ |
| Packaging Details | 20KG/bag | Color | White |
| Product type | PA Hot Melt Adhesive Powder | Melt Flow Index | 30±3 g/10min |
| Model Number | ES214 | Supply Ability | 4000000 |
| Appearance | White Powder | Density | 1.10±0.02 g/cm³ |
| Certification | Rosh, Reach | Brand Name | Easun |
| Payment Terms | T/T | Price | Negotiable |
| Delivery Time | 3-8 working day | Minimum Order Quantity | 20KG |
| Packaging | 20KG in one PE bag+Brown paper | Powder size range | 0-80 μm; 80-200 μm;150-250 μm |
PA
Hot
Melt
Glue
Powder
Polyamide
Heat
Transfer
Adhesive
Powder
PA
Hot
Melt
Adhesive
Powder Product
model:
ES214
Description:PA polyamide
thermoplastic
powder
hot
melt
adhesive..It
has
good
adhesion
and
good
washing
resistance
to
textile
fabrics.Suitable
for
ordinary
enzymatic
washing.
Function:Heat
transfer,Silk
screen
printing.
Physical
Characteristics:
| Property | Criterion |
| Appearance | White powder |
| Composition | TPU |
| Density ASTM D-792 | 1.10±0.02 g/cm³ |
| Melt Point DSC | 108-120 ℃ |
| Melt Index ASTM D-1238 | 30±3 g/10min |
| Powder size range | 0-80 um |
| 80-200 um | |
| 150-250 um |
Technical
Parameters:
| Bonding parameters (for reference only) | Temperature | 130℃ |
| Press | 3kg/cm2 | |
| Time | 14S | |
| Washing Resistance | 40℃ | Excellent |
| 60℃ | Excellent | |
| 90℃ | General |
Packaging and Storage Conditions:
| Packaging | 20KG in one PE bag+Brown paper bag |
| Storage Conditions | Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed. |
1.
The
bonding
conditions
used
will
vary
between
machines
and
materials.
The
conditions
indicated
here
are
only
basic.
The
most
ideal
bonding
conditions
should
be
established
by
manufacturing
for
the
specific
application.
