Metal
Bond
Diamond
Grinding
Wheel
for
Silicon
Wafer
Edge
Grinding
Product
Overview
Metal
bond
and
resin
bond
wheels
are
specifically
designed
for
edge
grinding
on
the
outer
circumference
of
silicon
wafers.
These
wheels
deliver
uniform
sharpness
while
maintaining
precision
accuracy
in
wheel
shape
and
exceptional
abrasion
resistance.
Available
for
both
outer-circumference
machining
and
notch
machining,
our
wheels
come
in
three
types:
single-groove,
multi-groove,
and
composite
rough
finishing.
Name
|
Metal
bond
grinding
wheel
|
Grinding
method
|
Dry
or
Wet
grinding
|
Diameter
|
100mm,
120mm,
160mm,
200mm,
250mm,
300mm,
customized
|
Arbor
hole
|
16mm,
17mm,
22mm,
32mm
or
customized
|
Grit
size
|
80#
120#
150#
200#
240#
280#
320#
350#
380#
400#
450#
500#
600#
800#,
customized
|
Model
|
1A1,
1A1R,
1V1,
6A2,
12A2,
11A2,
11V9,
etc
|
Key
Benefits
-
Low
maintenance
requirements
-
Increased
production
output
-
Exceptional
wear
resistance
-
Longer-lasting
wheel
sharpness
-
Superior
heat
transfer
from
ground
material
-
Extended
product
life
cycle