Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding

Price FOB
MOQ 2 pcs
Delivery Time 5 work days
Brand Shine Abrasives
Place of Origin China
Certification ISO
Model Number 4V2 1A1 14A2
Packaging Details one in paperbox
Payment Terms L/C, T/T
Supply Ability 1000 PCS in one week

Product Details

Product Specification

Brand Name Shine Abrasives Payment Terms L/C, T/T
Place of Origin China Price FOB
Delivery Time 5 work days Minimum Order Quantity 2 pcs
Packaging Details one in paperbox Model Number 4V2 1A1 14A2
Supply Ability 1000 PCS in one week Certification ISO

Product Description

Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding
Product Overview

Metal bond and resin bond wheels are specifically designed for edge grinding on the outer circumference of silicon wafers. These wheels deliver uniform sharpness while maintaining precision accuracy in wheel shape and exceptional abrasion resistance. Available for both outer-circumference machining and notch machining, our wheels come in three types: single-groove, multi-groove, and composite rough finishing.

Name Metal bond grinding wheel
Grinding method Dry or Wet grinding
Diameter 100mm, 120mm, 160mm, 200mm, 250mm, 300mm, customized
Arbor hole 16mm, 17mm, 22mm, 32mm or customized
Grit size 80# 120# 150# 200# 240# 280# 320# 350# 380# 400# 450# 500# 600# 800#, customized
Model 1A1, 1A1R, 1V1, 6A2, 12A2, 11A2, 11V9, etc
Key Benefits
  • Low maintenance requirements
  • Increased production output
  • Exceptional wear resistance
  • Longer-lasting wheel sharpness
  • Superior heat transfer from ground material
  • Extended product life cycle
Metal bond diamond grinding wheel for silicon wafer edge grinding

ZHENGZHOU SHINE ABRASIVES CO.,LTD

Manufacturer, Importer, Exporter
  • Employees: 51~100
  • Year Established: 2008