| Price | Negotiated |
| MOQ | 100pieces |
| Delivery Time | Negotiable |
| Payment Terms | T/T, Western Union |
| Shipping Method | Express | Operating Temperature | C Temp (-25C to 85C) 4GB - 128GB,I temp (-40C to 105C) 8GB – 64GB |
| Description | KIOXIA HOLDINGS 8GX8Bits eMMC 5.1 Memory Chips | Category | Electronic components-Memory |
| Dimensions | 11.5 x 13mm 153 ball BGA package ( 4GB also offered in 11x10mm package) | Payment Terms | T/T, Western Union |
| Selection Part numbers | THGBMNG5D1LBAIT THGBMNG5D1LBAIL THGBMJG6C1LBAIL THGBMJG7C1LBAIL THGBMJG8C2LBAIL THGAMRG7T13BAIL THGAMRG8T13BAIL THGAMRG9T23BAIL THGAMRTOT43BAIR THGBMJG6C1LBAU7 THGBMJG7C2LBAU8 THGBMJG8C4LBAU8 | Price | Negotiated |
| Product specifications Interface | IOXIA controller Serial interface High speed reads/writes Low pin count 32GB - 512GB BiCS FLASH™ 3D flash memory JEDEC standard | Capacity | 4GB, 8GB MLC product 16GB, 32GB, 64GB, 128GB BiCS FLASH 3D flash memory product |
| Minimum Order Quantity | 100pieces | Family | KIOXIA HOLDINGS 8GX8Bits eMMC 5.1 Memory Chips |
| Application | Smartphones AR/VR Tablets/2-in-1 Automotive Streaming Media Smart Speakers | Stock | In Stock |
KIOXIA HOLDINGS 8GX8Bits eMMC 5.1 Memory IC Chips
MANAGED FLASH | EMMC Part numbers:
THGBMNG5D1LBAIT
THGBMNG5D1LBAIL
THGBMJG6C1LBAIL
THGBMJG7C1LBAIL
THGBMJG8C2LBAIL
THGAMRG7T13BAIL
THGAMRG8T13BAIL
THGAMRG9T23BAIL
THGAMRTOT43BAIR
THGBMJG6C1LBAU7
THGBMJG7C2LBAU8
THGBMJG8C4LBAU8
THGBMJG9C8LBAU8
Application:
Smartphones
AR/VR
Tablets/2-in-1
Automotive
Streaming
Media
Smart
Speakers
e-MMC Key Features:
•
KIOXIA
controller
•
Parallel
interface
•
Easy
adoption
for
SoC
•
C
Temp
(-25C
to
85C)
4GB
-
128GB
•
I
temp
(-40C
to
105C)
8GB
–
64GB
•
BiCS
FLASH™
3D
flash
memory
from
16GB
•
JEDEC
standard
•
11.5
x
13mm
153
ball
BGA
package
(
4GB
also
offered
in
11x10mm
package)
Managed Flash Memory Solutions
Our UFS (Universal Flash Storage) and e-MMC Managed Flash solutions integrate flash memory and a KIOXIA controller in a single package. An ideal replacement for e-MMC, UFS combines the high performance, power efficiency and enhanced reliability demanded by mobile applications, including smartphones, tablets, AR/VR, automotive and more.
THGAF8G8T23BAIL
THGAF8G9T43BAIR
THGAF8T0T43BAIR
THGAF8T1T83BAIR
THGJCT0T44BAIL
THGJCT1T84BAIC
THGJCT2T84BAIC
THGJFATOT44BAIL
THGJFAT1T84BAIR
THGJFAT2T84BAIR