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| Price | 30 |
| MOQ | 50 |
| Delivery Time | 10~15days |
| Brand | CUBERYLLIUM® |
| Place of Origin | China |
| Certification | ISO,SGS |
| Model Number | UNS C17200 |
| Packaging Details | in coil packed into wooden case |
| Payment Terms | L/C, T/T, Western Union |
| Supply Ability | 200T/Month |
| Place of Origin | China | Machining Property | Good |
| Size | 505 MM X 505 MM X 28 MM | Packaging Details | in coil packed into wooden case |
| CUBERYLLIUM® Grade | CUBERYLLIUM® 172 | Standard | ASTM B194 |
| Model Number | UNS C17200 | Supply Ability | 200T/Month |
| Certification | ISO,SGS | Name | UNS C17200 BERYLLIUM COPPER PLATE |
| Surface | Bright/Polished | Brand Name | CUBERYLLIUM® |
| Payment Terms | L/C, T/T, Western Union | Safe Handling | No special health risk. |
| Price | 30 | Delivery Time | 10~15days |
| State | TF00 | Minimum Order Quantity | 50 |
| Application | For Oil Process Platform | Flatness | Good |
UNS C17200 BERYLLIUM COPPER PLATE SIZE 505 MM X 505 MM X 28 MM SOLID COPPER SHEET
Product Normal Description:
Product Name: Berylliium copper plate
Standard: UNS C17200
Product Size: 505mm x 505mm x 28mm
State: TF00
Product Brand: CUBERYLLIUM®
We are supplying Beryllium Copper Plates to various sectors and meeting their expectations. We are serving plates to electrical industries to use in connectors, fuse clips contact bridges, Electrical Switch and relay blades, spring connectors, switch parts, navigational instruments, relay parts, washers etc. We are also providing plates to different fasteners like lock washers, retaining rings, Washers, roll pins, screws, and bolts. Our Beryllium Copper plates are also provided to use in welding equipment, Pumps, springs, electrochemical, shafts, bushings, non-sparking safety tools, flexible metal hose, housings for instruments, bearings, valve seats, valve stems, diaphragms, springs, rolling mill parts, spline shafts, pump parts, and bourdon tubes.
Chemical Composition of UNS C17200 BERYLLIUM COPPER ALLOY:
Product Grade: CUBERYLLIUM ®-172(UNS. C17200)
| Numbering | Be | Co+Ni | Cu | Fe | Pb | Si | Al |
| C17200 | 1.8-2.0 | ≥0.2 | Margin | 0.15 | - | 0.15 | 0.15 |
Note: Copper plus additions equal 99.5% Minimum.
Standard Specificaiton For UNS C17200 BERYLLIUM COPPER PLATE:
| Standards | ASTM B194 |
| Grade | Alloy 25 (C17200), CDA 172 |
| Specifications | AMS 4530, AMS 4533, AMS 4534, AMS 4650, AMS 4651, SAE J461, SAE J463, JIS H 3130, RWMA Class 4 |
| Temper | A(TB00),H(TD04),AT(TF00),HT(TH04) |
Typical Physical Properties of UNS C17200 BERYLLIUM COPPER ALLOY:
| Density (g/cm3): | 8.36 |
| Density before age hardening (g/cm3): | 8.25 |
| Elastic Modulus (kg/mm2 (103)): | 13.4 |
| Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): | 17 x 10-6 |
| Thermal Conductivity (cal/(cm-s-°C)): | 0.25 |
| Melting Range (°C): | 870-980 |
Temper Designations of UNS C17200 BERYLLIUM COPPER PLATE:
| Mechanical and Electrical Properties of C17200 Sheet/Plate | |||||||
| CUBERYLLIUM | ASTM | Heat Treatment |
Thickness (mm) |
Tensile Strength (Mpa) |
Elongation Percent |
HARDNESS Rockwell B or C Scale |
Electrical
Conductivity (% IACS) |
| Designation | Designation | ||||||
| A | TB00 | All Size | 400~580 | 20~60 | B45-85 | 15～19 | |
| H | TD04 | ＜10 | 600~880 | 8~20 | B91-103 | 15～19 | |
| 10~25 | 600~850 | 8~20 | B90-102 | 15 ~ 19 | |||
| 25~50 | 580~820 | 8~20 | B88-102 | 15 ~19 | |||
| ＞50 | 580~820 | 8~20 | B88-102 | 15 ~19 | |||
| AT | TF00 |
3 hr 315℃ |
All Size | 1120~1358 | 3~10 | C36-41 | 22 ~ 28 |
| HT | TH04 | 2 hr 315℃ | ＜10 | 1200~1450 | 1~5 | C38-45 | 22 ~ 28 |
| 10~25 | 1200~1500 | 1~5 | C38-44 | 22 ~ 28 | |||
| 25~50 | 1200~1450 | 2~5 | C37-43 | 22 ~ 28 | |||
| ＞50 | 1100~1350 | 2~5 | C36-42 | 22 ~ 28 | |||
Product Photos:
Key Technology of Beryllium Copper(Heat treatment)
Age Hardening
Age hardening significantly enhances the material’s strength. This reaction is generally carried out at temperatures between 260°C and 540°C depending on alloy and desired characteristics. This cycle causes the dissolved beryllium to precipitate as a beryllium rich (gamma) phase in the matrix and at the grain boundaries. It is the formation of this precipitate which causes the large increase in material strength. The level of mechanical properties attained is determined by the temperature and time at temperature. It should be recognized that beryllium copper has no room temperature aging characteristics.
