Uncooled LWIR Thermal Security Camera Module with 256x192 Resolution and 12μm Pixel Pitch in Wafer Level Package

Uncooled LWIR 256x192 / 12 μm Thermal Imaging Module for Thermal Security Camera

TIMO212 uncooled IR imaging module, also known as the uncooled thermal module, is radiometric-capable and has available infrared non-contact temperature measurement function. It includes an exceptionally small size 256x192 / 12μm wafer level package (WLP) infrared detector that captures long-wave infrared (LWIR) spectrum that ranges from 8 to 14μm.

Due to its fully optimized SWaP-C, the TIMO212 thermal camera module has low resolution, small size, low power consumption and very low price. Thus, in the field of security and monitoring, it is very suitable for the wide angle and close range temperature measurement and monitoring.

• Ultra-Miniature Module with Ultimate SWaP-C Optimization
  • Wafer-level packaged detector + wafer-level optics + micro-electromagnetic valve shutter
  • The smallest infrared thermal module, enabling basic thermal imaging functionality with maximum cost efficiency
  • Compact size, lightweight, and low power consumption, ideal for integration into miniature devices
• Flexible Optic Options, Accurate Temperature Measurement
  • Multiple lens options available, including wide-angle and telephoto, to meet diverse application needs
  • High-precision temperature measurement with accuracy up to ±2°C; supports both regional and full-frame temperature monitoring
• Easy Integration, Fast Development
  • Supports DVP image interface, compatible with various embedded platforms
  • Compliant with RoHS 2.0 environmental standards

The TIMO212 thermal imaging module is applied to the field of Smart Security, AloT, Night Observation, Instruments and Meters, Machine Vision etc.

• Deep Technical Expertise - With many years of experience in the research, development, and application of infrared sensor technology, we have built strong capabilities across chip design, wafer fabrication, packaging and testing, as well as system integration.
• Focused on Innovation and Practical Implementation in Infrared Sensing - We are committed to driving technological breakthroughs in thermal imaging, constantly pushing the boundaries in NETD, SWaP, and operating temperature.
• Diversified Product Portfolio - Backed by independent R&D and multiple technical pathways, we offer a comprehensive range of infrared detection components—both cooled and uncooled.
• Rigorous Reliability Validation Ensures Quality Assurance - Supported by a robust quality management system, our products undergo multiple testing procedures throughout production to ensure long-term stability and reliability.
• Professional Technical Support and Joint Development Services - Our engineering team works closely with customers' R&D and product teams to accelerate system integration, improve efficiency, and shorten time-to-market.

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. We are now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.