Single Sided 94v0 30W LED Printed Circuit Board Aluminum Plate

Price	Negotiable
MOQ	2PCS
Delivery Time	10-12 work days
Brand	Yizhuo
Place of Origin	China
Certification	CE,ROHS,UL
Model Number	single-side 05
Packaging Details	Vacuum Package+ Good quality carton box
Payment Terms	T/T, Western Union

Product Details

Product Specification

Place of Origin	China	Copper Thickness	0.5oz-2oz
Packaging Details	Vacuum Package+ Good quality carton box	Min. Hole Size	0.20mm
Model Number	single-side 05	Certification	CE,ROHS,UL
Brand Name	Yizhuo	Payment Terms	T/T, Western Union
Type	Electronic Board	Delivery Time	10-12 work days
Product name	led pcb board	Minimum Order Quantity	2PCS
Voltage	165-265V	Base Material	aluminum

Product Description

Single Sided 94v0 30W LED Printed Circuit Board Aluminum Plate

30W LED Aluminum Plate single-side 94v0 PCB Board For Led bulbs light

A thin layer of thermally conductive but electrically insulating dielectric is laminated between a metal base and a copper foil. The copper foil is etched into the desired circuit pattern and the metal base draws heat away from this circuit through the thin dielectric.
Aluminum PCB is a unique metal-based copper clad laminate; it has good thermal conductivity, electrical insulation and machining performance. Aluminum PCB market mostly Fuchs Wright aluminum substrate. Common in the LED lighting products.
Aluminum PCB is one of metal-based pcb, including copper foil, thermal insulating layer and metal substrate, its structure divide into three layers:

Circuit layer: the equivalent of an ordinary PCB, copper thickness from 1oz to 10oz.
Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance. Thickness: 0.003 "to 0.006" inch is the aluminum pcb core technology.
Based Layer: a metal substrate, usually aluminum or copper may be chosen.

Item	Capability
Layers	1-30
Thicker Copper	1-6OZ
Products Type	HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board , BGA& Fine Pitch board
Solder Mask	Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material	FR4(Shengyi China,ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic,Argon and so on
Finished Surface	Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment	ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger
Technical Specification	Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm
Tolerance	Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H E-Test voltage :500V+15/-0V 30S Warp and Twist: 0.7% (semiconductor test board≤0.3% )