English
Sign in
| Price | Message us |
| MOQ | 4000pcs |
| Delivery Time | 7 workdays |
| Brand | AMPFORT |
| Place of Origin | Dongguan,China |
| Certification | UL,ROHS |
| Model Number | CMF |
| Packaging Details | Tape , 4000pcs per reel |
| Payment Terms | T/T, Western Union |
| Supply Ability | 10,000,000pcs per week |
| Place of Origin | Dongguan,China | Size | 0402,0603,0805,1206 |
| Packaging Details | Tape , 4000pcs per reel | Model Number | CMF |
| Supply Ability | 10,000,000pcs per week | Certification | UL,ROHS |
| Name | Chip NTC Thermistor | Brand Name | AMPFORT |
| Payment Terms | T/T, Western Union | Resistance value accuracy | 0.5%, 1%, 2%, 3%, 5% |
| R25 | 2.2K, 4.7K, 10K, 22K, 33K, 47K, 56K, 68K, 100K, 220K, 330K, 470K, 560K, | Price | Message us |
| Delivery Time | 7 workdays | Minimum Order Quantity | 4000pcs |
| Beta value | 3380, 3435, 3500, 3600, 3800, 3950, 4050, 4150, 4250, 4350, and other B values | Operating temperature | -40℃~+150℃ |
Surface
Mounted
Devices
CMF
Chip
NTC
Thermistor
0402
0603
0805
1206
4.7K
10K
22K
100K
Description
Of
The Chip
NTC
Thermistor
0402
0603
0805
1206
NTC
(Negative
Temperature
Coefficient)
Thermistor
is
a
kind
of
heat-sensitive
semiconductor
resistor.
Its
resistance
value
decreases
with
the
increase
of
temperature.
The
temperature
coefficient
of
resistance
is
in
the
range
of
-2%/k~-6%/k,
which
is
about
metal
10
times
the
temperature
coefficient
of
resistance.
The
change
of
the
resistance
of
NTC
thermistor
can
be
caused
by
the
change
of
the
external
environment
temperature,
or
it
can
be
caused
by
the
current
flowing
through
and
self-heating.
His
various
uses
are
based
on
this
characteristic.
NTC
thermistor
is
made
of
polycrystalline
ceramic
of
mixed
oxide.
The
conductive
mechanism
of
this
material
is
quite
complicated.
Application
Range Of
The
Chip
NTC
Thermistor
0402
0603
0805
1206
•
Temperature
measurement:
gas
meter,
water
heater,
electric
kettle,
electronic
thermometer,
electronic
perpetual
calendar,
electronic
clock
temperature
display,
electronic
gifts,
etc.;
•
Temperature
control:
temperature
sensing
of
rechargeable
batteries
in
mobile
phones,
car
phones,
notebook
computers,
smart
wearable
devices,
etc.;
•
Temperature
compensation:
temperature
compensation
of
transistors,
ICs
and
crystal
oscillators
of
mobile
communication
equipment
Features Of
The
Chip
NTC
Thermistor
0402
0603
0805
1206
1)
Small
size,
no
lead,
excellent
welding
performance,
suitable
for
high-density
surface
mount;
2)
The
surface
of
the
porcelain
body
is
encapsulated
by
glass,
which
has
good
moisture
resistance,
high
reliability
and
stability;
3)
Wide
operating
temperature
range:
-40℃~+150℃;
4)
High-precision
resistance
constants:
2.2K,
4.7K,
10K,
22K,
33K,
47K,
56K,
68K,
100K,
220K,
330K,
470K,
560K,
5)
High-precision
B
value
constants:
3380,
3435,
3500,
3600,
3800,
3950,
4050,
4150,
4250,
4350,
and
other
B
values
6)
Resistance
value
accuracy:
0.5%,
1%,
2%,
3%,
5%
Dimension
Of
The
Chip
NTC
Thermistor
0402
0603
0805
1206
(mm)
| Size | L | W | T | M |
| 0402 (1005) | .04± .006 (1.0 ±0.15 ) |
.02
±
.004 |
.024max (0.60max) | .004min (0.10min) |
| 0603 (1608 ) | .063 ± .006 (1.6*0.15 ) |
.031
±
.006 |
.037max (0.95max) | .004min (.0.10min) |
| 0805 (2012 ) |
.08
±
.008 |
.05
±
.008 |
.05max |
.006min (0.15min) |
Specification Of
The
Chip
NTC
Thermistor
0402
0603
0805
1206
0402
Series
SMD
Thermistor
Parameters
| Part No | Resistance at 25 °C (Ω) | B-value25/85 °C (K) |
| CMFX39F103 | 10 | 3950 |
| CMFX40F473 | 47 | 4050 |
| CMFX40F104 | 100 | 4050 |
0603 Series
Chip Thermistor
Parameters
| Part No | Rdsistance at 25°C (Ω) | B-value25/85°C(K) |
| CMFA34F103口 | 10 | 3450 |
| CMFA39H103口 | 10 | 3970 |
| CMFA39Z223口 | 22 | 3900 |
| CMFA39F473口 | 47 | 3950 |
| CMFA39F104口 | 100 | 3950 |
| CMFA39F224口 | 220 | 3950 |
| CMFA35F103口 | 10 | 3550 |
| CMFA39F683口 | 68 | 3950 |
| CMFA41Z564口 | 560 | 4100 |
0805
Series
SMD
NTC
Thermistor
Parameters
| Part No | Resistance at 25°C(KΩ) | B-value 25/85 |
| CMFB34G472 □ | 4.7 | 3435 |
| CMFB34G103 □ | 10 | 3435 |
| CMFB35FI03 □ | 10 | 3550 |
| CMFC39Z223 □ | 22 | 3900 |
| CMFB40Z473 □ | 47 | 4000 |
| CMFB40Z104 □ | 100 | 4000 |
| CMFB40ZI03 □ | 10 | 3970 |
| CMFB32Z202 □ | 2 | 3200 |
| CMFB36F153 □ | 15 | 3650 |
| CMFB40F333 □ | 33 | 4050 |
1206
Series
Chip
NTCThermistor
Parameters
| Part No | Resistance at25 °C (KΩ) | B-value25/50 °C(K) |
| CMFC32Z221口 | 0.22 | 3200 |
| CMFC32Z331口 | 0.33 | 3200 |
| CMFC32F471口 | 0.47 | 3250 |
| CMFC32F681口 | 0.68 | 3250 |
| CMFC33F102口 | 1.0 | 3350 |
| CMFC34Z222口 | 2.2 | 3400 |
| CMFC34Z332口 | 3.3 | 3400 |
| CMFC34Z472口 | 4.7 | 3400 |
| CMFC34Z682口 | 6.8 | 3400 |
| CMFC35Z103口 | 10 | 3500 |
| CMFC39Z103口 | 10 | 3900 |
| CMFC39Z153口 | 15 | 3900 |
| CMFC39F223口 | 22 | 3950 |
| CMFC40Z333口 | 33 | 4000 |
| CMFC41Z473口 | 47 | 4100 |
| CMFC41Z683口 | 68 | 4100 |
| CMFC42Z104口 | 100 | 4200 |
| CMFC43Z224口 | 220 | 4300 |
Application
of
SMD
NTC
Thermistor
in
5G
Electronic
Equipment
As
5G
technology
is
widely
used
in
various
devices,
the
5G
era
has
finally
come.
The
key
differences
between
5G
and
the
early
2G,
3G
and
4G
mobile
communications
are:
1.
The
communication
speed,
the
amount
of
information
processed,
and
the
connection
capacity
have
been
greatly
improved
to
meet
the
needs
of
high-definition
images,
videos,
virtual
reality
and
other
large
data
transmission
and
real-time
applications
such
as
automatic
driving,
telemedicine,
and
Internet
of
Things
communication;
2.
With
continuous
wide
area
coverage
and
high
mobility,
the
user
experience
rate
reaches
100Mbit/s.
3.
The
system
is
coordinated,
and
the
level
of
intelligence
is
improved,
which
is
manifested
as
a
multi-user,
multi-point,
multi-antenna,
multi-intake
collaborative
networking,
and
flexible
and
automatic
adjustments
between
networks.
All
of
the
above
features
increase
the
load
of
related
components
in
5G
equipment,
and
the
heat
source
also
increases.
Multiple
heat
sources
will
also
affect
heat
transfer.
The
previous
measures
taken
on
a
single
heat
source
may
not
be
suitable
for
processing
5G
electronic
equipment
at
the
same
time.
The
status
of
multiple
feature
hotspots.
Based
on
the
above
background,
it
is
particularly
important
to
monitor
the
temperature
of
multiple
functional
hot
spots
on
the
substrate
and
to
control
the
performance
of
the
heat-generating
component
according
to
the
complex
functions
of
the
electronic
device.
For
example,
when
the
CPU
loads
a
large
application
program,
the
temperature
is
low
in
the
initial
stage
and
runs
at
full
power.
If
the
CPU
temperature
increases,
the
performance
will
decrease,
and
the
threshold
temperature
control
cannot
be
exceeded.
At
this
time,
if
the
heat
generated
by
the
power
supply
to
the
CPU
is
large
and
the
CPU
can
receive
the
heat
from
the
power
supply
unit,
the
temperature
of
the
CPU
may
rise
sharply.
To
consider
the
temperature
around
the
CPU
and
around
the
power
IC
at
the
same
time,
it
is
necessary
to
control
the
performance
of
each
device
more
finely.
While
controlling
the
temperature
of
the
device
on
the
substrate,
it
should
also
be
noted
that
since
the
heating
device
continues
to
generate
heat,
it
may
require
final
overheating
protection-such
as
displaying
a
warning
or
switching
to
the
off
state.
It
is
necessary
to
consider
the
internal
temperature
of
each
heat
source,
IC,
and
module
on
the
substrate,
as
well
as
the
heat
exchange
between
each
other
and
the
temperature
change
of
the
surrounding
environment
where
the
electronic
device
is
placed.
Only
by
monitoring
the
temperature
around
the
heat
source
can
the
temperature
management
mentioned
above
be
carried
out.
The
chip
NTC
thermistor
is
suitable
for
surface
mounting
as
the
same
EIA
size
standard
chip
resistors,
capacitors,
inductances,
etc.
It
has
a
high
degree
of
freedom
in
configuration,
a
small
space,
and
a
simple
circuit
to
obtain
the
expected
accuracy,
so
the
chip
NTC
thermistor
is
very
suitable
as
a
temperature
sensor
to
be
placed
on
the
substrate
to
be
measured,
to
realize
the
temperature
monitoring
of
the
substrate.
