Custom Optoelectronic Chip Waffle Pack Tray Cover Clip PC PP Material

Price $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ 1000 pcs
Delivery Time 6~8 working days
Brand Hiner-pack
Place of Origin CHINA
Certification ROHS ISO
Model Number HN21068
Packaging Details It depends on the QTY of order(500PCS/20KG/50*40*30CM)
Payment Terms T/T
Supply Ability 3000~3500 Set/per day

Product Details

Product Specification

Temperature 80°C Place of Origin CHINA
Packaging Details It depends on the QTY of order(500PCS/20KG/50*40*30CM) Color Black
Material PC PP Model Number HN21068
Supply Ability 3000~3500 Set/per day Certification ROHS ISO
Brand Name Hiner-pack Payment Terms T/T
Clean Class General And Ultrasonic Cleaning Price $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Delivery Time 6~8 working days Surface Resistance 1.0x10E4~1.0x10E11Ω
Minimum Order Quantity 1000 pcs Including Base+Cover+Clip
Matrix QTY 11x13=143PCS Incoterms EXW,FOB,CIF,DDU,DDP

Product Description

Custom Optoelectronic Chip Waffle Pack Tray Cover Clip PC PP Material

 

Custom Optoelectronic Chip Waffle Pack Tray Cover And Clip

 

Waffle pack packaging needs to match the cover and clamps together for the best effect, can effectively fix the product placement position, even if there is shaking in the transportation can still stabilize the product is not affected by any, widely used in the packaging of wafer particles after cutting and small size electronic components.

 

Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.

 

Product Feature

 

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity

Outline Line Size 101.6*101.6*7.11mm Brand Hiner-pack
Model HN21068 Package Type IC
Cavity Size 5.69*4.28*1.3mm Matrix QTY 11*13=143PCS
Material PC Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

 

Product Application

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

FAQ

 

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

For more information, please contact our sales department

 

Hiner-Pack 4 Inch Waffle Pack Catalogue.pdf

Shenzhen Hiner Technology Co., Ltd.

Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
  • Annual Revenue: 5,000,000.00-10,000,000.00
  • Employees: 80~100
  • Year Established: 2013