Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Price	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ	500 pcs
Delivery Time	10 workdays
Brand	Hiner-pack
Place of Origin	China
Certification	ROHS, ISO
Model Number	HN25001
Packaging Details	CARTON, PALLET
Payment Terms	T/T
Supply Ability	2000PCS/Day

Product Details

Product Specification

Ic Type	BGA,QFP,QFN,LGA,PGA	Place of Origin	China
Tray Shape	Rectangular	Packaging Details	CARTON, PALLET
Color	Black	Cavity Size	322.6×135.9×12.19 mm
Mold Type	Injection	Model Number	HN25001
Supply Ability	2000PCS/Day	Certification	ROHS, ISO
Brand Name	Hiner-pack	Payment Terms	T/T
Clean Class	General And Ultrasonic Cleaning	Price	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Delivery Time	10 workdays	Reusable	Yes
Capacity	7x12=84 PCS	Minimum Order Quantity	500 pcs
Tray Weight	Varies, Typically Up To 500 Grams Per Cavity	Quality Assurance	Delivery Guarantee, Reliable Quality
Incoterms	EXW, FOB, CIF, DDU, DDP	Packing Level	Transport package
Flatness	Less than 0.76mm

Product Description

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Reduce dust contamination effectively. Protect delicate semiconductor components during wafer level packaging. Offer reliable structural durability for repeated industrial use. Need stable IC tray solutions for clean production?

Fit automated semiconductor packaging lines. Adapt to wafer level processing and component handling workflows. Maintain cleanroom compatibility and consistent performance.

Support safe component storage and logistics. Offer customizable cavity layouts and sizes. Create tailored JEDEC tray designs to match unique packaging requirements.

Key Features/ Benefits

Deliver durable construction.
Reduce dust contamination.
Safeguard wafer packaging processes.
Comply with JEDEC standards.
Support custom design solutions.

Specifications

Brand		Hiner-pack
Model		HN25001
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×12.19 mm
Cavity Size		16×9.5×4.72 mm
Matrix QTY		7x12=84 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Product Details

Product Specification

Product Description

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Shenzhen Hiner Technology Co., Ltd.