180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Price	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ	500 pcs
Delivery Time	10 workdays
Brand	Hiner-pack
Place of Origin	China
Certification	ROHS, ISO
Model Number	HN24220
Packaging Details	CARTON, PALLET
Payment Terms	T/T
Supply Ability	2000PCS/Day

Product Details

Product Specification

Ic Type	BGA,QFP,QFN,LGA,PGA	Place of Origin	China
Tray Shape	Rectangular	Packaging Details	CARTON, PALLET
Color	Usually black or dark gray for ESD protection	Cavity Size	4x5x1.6 mm
Mold Type	Injection	Model Number	HN24220
Supply Ability	2000PCS/Day	Certification	ROHS, ISO
Brand Name	Hiner-pack	Payment Terms	T/T
Clean Class	General And Ultrasonic Cleaning	Price	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Delivery Time	10 workdays	Reusable	Yes
Capacity	13x28=364 PCS	Minimum Order Quantity	500 pcs
Tray Weight	Varies, Typically Up To 500 Grams Per Cavity	Quality Assurance	Delivery Guarantee, Reliable Quality
Incoterms	EXW, FOB, CIF, DDU, DDP	Packing Level	Transport package
Flatness	Less than 0.76mm

Product Description

High Temp ESD JEDEC Tray for AI Chips Packaging

This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.

Key Features/ Benefits

Up to 180°C high temperature resistant (PEI material)
Stable ESD protection (1E4–1E11 Ω)
Compatible with ASM / Advantest / YAMAHA machines
Free design within 24 hours
JEDEC standard footprint

Specifications

Brand		Hiner-pack
Model		HN24220
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		4x5x1.6 mm
Matrix QTY		13x28=364 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

AI chips / GPU / ASIC
BGA / QFN / IC packaging
Burn-in & baking process
Production line buffering

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

10+ years semiconductor packaging experience
In-house mold design capability
OEM & ODM customization supported
Consistent quality and stable supply
Daily capacity: 2000+ pcs

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Product Details

Product Specification

Product Description

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Shenzhen Hiner Technology Co., Ltd.