English
Sign in
| Price | $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities） |
| MOQ | 1000 Pcs |
| Delivery Time | 5~8 Working Days |
| Brand | Hiner-pack |
| Place of Origin | Shenzhen,China |
| Certification | ROHS |
| Model Number | HN24045 |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Place of Origin | Shenzhen,China | Shape | Rectangular |
| Use | Transport, Storage, Packing | Size | Customized |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product | Color | Black |
| Injection Mold | Lead Time 20~25 Days | Model Number | HN24045 |
| Supply Ability | 4000PCS~5000PCS/per Day | Certification | ROHS |
| Brand Name | Hiner-pack | Payment Terms | T/T |
| Place Of Origin | Shenzhen, China | Anti-Static | Yes |
| Price | $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities） | Delivery Time | 5~8 Working Days |
| Minimum Order Quantity | 1000 Pcs | Heat Resistant | Yes |
| Flatness | <0.3mm |
Our Bare Die Trays can provide a secure and organized way to handle delicate bare die components during production, assembly, testing, and shipping.They are designed in a rectangular shape to efficiently accommodate multiple bare die chips. Their customized size ensures a perfect fit for various die sizes, offering flexibility and versatility in handling different types of components. These trays come in a sleek black color, giving them a professional and modern look suitable for industrial environments.
| Durability | Sturdy And Impact-Resistant |
| Color | Black |
| Injection Mold | Lead Time 20~25 Days |
| Capacity | Holds Multiple Bare Die Chips |
| Customizable Logo | Yes |
| Flatness | <0.3mm |
| Shape | Rectangular |
| Size | Customized |
| Anti-Static | Yes |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
I.Chip On Board (COB) Assembly
Bare Die Trays provide secure positioning and electrostatic discharge (ESD) protection for singulated semiconductor dice during manual or automated COB assembly processes.
II.Flip Chip and 3D Packaging
The trays' precision-engineered pockets accommodate backside-exposed dice required for flip chip bonding, enabling accurate alignment during flux application and reflow processes.
♠Customized Packaging Solutions: We offer tailored Bare Die Trays designed to meet the specific requirements of your die sizes and configurations, ensuring optimal protection and handling during transportation and storage.
♠On-site Technical Support: Our team of experts provides on-site assistance for the installation, integration, and troubleshooting of Bare Die Trays, ensuring seamless operations and minimizing downtime.
Q:How long can the production be put into production after the order is placed?
A:Generally, it takes one or two working days.
Q:
What
is
the
minimum
order
quantity
for
the
Bare
Die
Trays?
A:
The
minimum
order
quantity
for
the
Bare
Die
Trays
is
1000
pieces.
