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| Price | Negotiation |
| MOQ | 1 piece |
| Delivery Time | 5-8 working days |
| Brand | ZG |
| Place of Origin | CHINA |
| Certification | CE |
| Model Number | MS |
| Packaging Details | Strong wooden box for global shipping |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram, MoneyGram |
| Supply Ability | 10000 pieces per month |
| Place of Origin | CHINA | Size | Customized |
| Packaging Details | Strong wooden box for global shipping | Color | Black |
| Material | Silicon Nitride Si3N4 | Model Number | MS |
| Supply Ability | 10000 pieces per month | Certification | CE |
| Brand Name | ZG | Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram, MoneyGram |
| Price | Negotiation | Delivery Time | 5-8 working days |
| Minimum Order Quantity | 1 piece | Features | high hardness; high corrosion resistance; low density; stability in a wide range of temperatures; precision machining capability. |
High-performance silicon nitride ceramic materials developed for the aluminum industry has significantly improved thermal and mechanical properties than similar products. On this basis, the "L-shaped high thermal conductivity submerged heating "Appliance" will bring revolutionary progress to aluminum industrial equipment.
Practical use has proved that silicon nitride ceramic is very suitable for the riser pipe of low-pressure casting.Compared with commonly used cast iron, aluminum titanate, silicon carbide and other materials, silicon nitride ceramics have the best thermal shock resistance, with a service life of more than one year.
Advantage:
Low wettability to aluminum water reduces slagging on the inner and outer walls of the riser pipe, which is convenient for daily maintenance.
Good corrosion resistance, can reduce aluminum water pollution, and help improve the quality of castings.
Silicon Nitride Related Data
| Main component | 99%Al2O3 | S-SiC | ZrO2 | Si3N4 | ||
|
Physical Property |
Density | g/cm3 | 3.9 | 3.1 | 6 | 3.2 |
| Water Absorption | % | 0 | 0.1 | 0 | 0.1 | |
| Sinter Temperature | °C | 1700 | 2200 | 1500 | 1800 | |
|
Mechanical Property |
Rockwell Hardness | HV | 1700 | 2200 | 1300 | 1400 |
| Bend Strength | kgf/mm2 | 3500 | 4000 | 9000 | 7000 | |
| Compression Intensity | Kgf/mm2 | 30000 | 20000 | 20000 | 23000 | |
|
Thermal Property |
Maximum
working temperature |
°C | 1500 | 1600 | 1300 | 1400 |
|
thermal
expansion coefficient 0-1000°C |
/°C | 8.0*10-6 | 4.1*10-6(0-500°C) | 9.5*10-6 | 2.0*10-6(0-500°C) | |
| 5.2*10-6(500-1000°C) | 4.0*10-6(500-1000°C) | |||||
| Thermal Shock resistance | T(°C) | 200 | 250 | 300 | 400-500 | |
| Thermal Conductivity | W/m.k(25°C | 31 | 100 | 3 | 25 | |
| 300°C) | 16 | 100 | 3 | 25 | ||
|
Electrical Property |
Resisting rate of Volume | ◎.cm | ||||
| 20°C | >1012 | 106-108 | >1010 | >1011 | ||
| 100°C | 1012-1013 | – | – | >1011 | ||
| 300°C | >1012 | – | – | >1011 | ||
|
Insulation
Breakdown Intensity |
KV/mm | 18 | semiconductor | 9 | 17.7 | |
| Dielectric Constant (1 MHz) | (E) | 10 | – | 29 | 7 | |
| Dielectric Dissipation | (tg o) | 0.4*10-3 | – | – | – | |
