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| Price | 10USD/PC |
| MOQ | 1 PC |
| Delivery Time | 5-8 work days |
| Brand | ZG |
| Place of Origin | China |
| Certification | CE |
| Model Number | MS |
| Packaging Details | Strong wooden box for Global shipping |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 1000 PCS |
| Brand Name | ZG | Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Place of Origin | China | Price | 10USD/PC |
| Delivery Time | 5-8 work days | Minimum Order Quantity | 1 PC |
| Packaging Details | Strong wooden box for Global shipping | Model Number | MS |
| Supply Ability | 1000 PCS | Certification | CE |
AlN Metalization (HTCC)
Aluminum
nitride(High
Temperature
Co-Fired
Ceramic)
is
a
kind
of
ceramic
substrate
with
high
thermal
conductivity
and
high
density,
whichis
made
by
pre-designed
circuit
through
punching,filling
andprinting
onthe
AlN
green
type,
and
then
laminated
and
sintered
at
high
temperature.
Advantage:
●
First
company
with
commercial
AIN
HTCC
mass
production
capacity
in
China
●
Independent
R&D
and
manufacturing
of
core
equipment:
hightemperature
refractory
metalfurnace
●
Master
the
special
formula
of
AIN
green
tape
for
HTCCMaster
the
special
formula
of
tungsten
slurry
for
HTCC
●
Design
and
development
capabilities
with
HTCC
products
Overall
technical
indicators:
·Specification
ofgreen
tape:6”
*6"
·thickness:120-200um
Minimum
Linewidth
of
HTCC
Printing:10Oum
Minimum
spacing
ofHTCC
printing:100um
·
HTCC
Conductor
Printing
Thickness:7-20um
Minimum
through-hole
diameter:100um
.
Warpage:<3um/mm
·HTCCLayers:3-30
·
Shrinkage
ofraw
porcelain
sheets
17%in
thedirection
ofXY
axis;
·
In
the
direction
of
Z
axis
19土3%
·Square
resistance:21.6Ω
Production application:
Our products are currently mainly used in LED packaging, microelectronics and semiconductors, automotive electronics, high-power power electronic modules, RF microwave communications, aerospace, and other fields.
Aluminum nitride not only can withstand high temperatures, corrosion, and the erosion of alloys and metals such as aluminum and iron, but it is also non-wetting to silver, copper, aluminum, lead, and other metals. Therefore, it can be used to make coatings for refractory materials or crucibles as surface protection materials. Additionally, it can be made into casting molds and crucibles and other structural materials. Nano aluminum nitride can be used as a dispersed phase in structural materials to enhance the thermal conductivity, rigidity, and strength of the matrix material. For example, aluminum nitride can be used to improve the rigidity and strength of certain metals, and it does not react with the metals at processing temperatures, which allows composites more time to form in the molten state and better control the interface between the matrix and the filler. Aluminum nitride is also used to improve the thermal conductivity and rigidity of polymer materials, reducing their thermal expansion. Studies have found that adding nano aluminum nitride to coarse and fine aluminum nitride powders can effectively improve the density and thermal fatigue resistance of aluminum nitride ceramics. Adding heat-treated nano aluminum nitride powders to corundum-spinel castables can enhance their erosion resistance.
With the development of the electronics industry, especially microelectronics technology, aluminum nitride ceramic materials are highly suitable for use as semiconductor substrates due to their excellent properties in thermal conductivity, insulation, dielectric characteristics, matching thermal expansion coefficient with silicon, and strength. They are also the best materials to replace alumina and beryllia substrate materials. Especially in the production of very-large-scale integrated circuits, as chip density continues to increase exponentially, traditional ceramic substrates are increasingly unable to meet the requirements, and aluminum nitride will take on this important role.
