This advanced ceramic disc series is engineered for precision carving, thinning, shaping, beveling, and polishing of gemstones, ceramics, and crystals. The product line includes grinding discs, files, grinding plates, and resin discs designed for industrial manufacturing applications.
Semiconductor Silicon Wafer Processing
Ceramic grinding discs represent the most advanced method for processing semiconductor silicon wafers. The double-sided grinding process utilizes ceramic discs to significantly enhance wafer quality through optimized grinding parameters including disc material composition, grinding fluid selection, pressure control, and rotational speed.
By replacing traditional cast iron discs with ceramic alternatives, manufacturers eliminate surface scratches and contamination, minimize metal ion introduction, reduce subsequent processing requirements, shorten etching times, improve production efficiency, and significantly decrease silicon wafer processing losses—dramatically increasing overall utilization rates.
