| Price | Negotiable |
| MOQ | 240kg |
| Delivery Time | 5-10 working days after payment |
| Brand | MC |
| Place of Origin | CHINA |
| Model Number | MCSIL-E160 |
| Packaging Details | 20kg per drum |
| Payment Terms | L/C, T/T, Western Union |
| Supply Ability | 4000kg per day |
| Viscosity | 3700±200 Mpa.s | Place of Origin | CHINA |
| Goods Description | Silicone in primary forms | Packaging Details | 20kg per drum |
| HS Code | 39100000 | Color | White/Grey liquid |
| Model Number | MCSIL-E160 | Mix ratio | 1:1 |
| Hardness | 56 JIS A⁰ | Supply Ability | 4000kg per day |
| Brand Name | MC | Payment Terms | L/C, T/T, Western Union |
| Dielectric breakdown voltage | ≥20 (KV/mm) | Price | Negotiable |
| Delivery Time | 5-10 working days after payment | Minimum Order Quantity | 240kg |
| Thermal conductivity | ≥0.58 (W/(m·K) | Application | Electronics parts Potting and Encapsulating |
Silicone Encapsulant MCSIL-E160 A/B
RTV2
Silicone
Potting
Compound
for
Electronics
Description
of RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
Silicone
compound
is
supplied
as
a
two-component
addition
cure
system.
It
consists
of
Part
A
and
Part
B.
The
component
A
is
white
and
component
B
is
black
for
easy
identification
and
inspection
of
complete
mixing.(colors
can
be
adjusted
as
per
customer
requirement.)
When
the
components
are
thoroughly
mixed
in
a
1:1
ratio
by
weight
or
volume,
the
liquid
mixture
cures
to
a
flexible
elastomer,
which
is
suited
for
electrical/electronic
potting
and
encapsulating
applications.

Applications of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
Silicone
is
a
general
purpose
compound
suited
for
adhesive
and
coating.
This
cost-effective
silicone
can
be
used
in
a
variety
of
electronic
potting
applications
including
the
adhesive
and
coating
for
solar
power,
HID,
LCD
displayers,
circuit
board
and
electronic
components,
etc.

Features of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
Silicone
compound
has
a
excellent
electrical
property
features
in
resistant
to
temperature,
corrosion,
radiation,
insulation,
waterproof,
damp
proofing,
shock
resistance,
thermal
conducting,
inflaming
retarding
and
weather
ability,
etc.
It
can
be
long-term
used
under
-50℃~200℃.
Typical
properties of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
Item
No.:
MCSIL-E160A/B
Appearance(A/B)
White/Grey
liquid
Viscosity(A/B,Mpa.s)
3700±2000
Mix
ratio
(A/B)
1:1
Pot
life
after
curing(25℃,min)
30-40
Curing
time
(hrs)
2-4
Thermal
conductivity(W/m·K)(A/B)
≥0.58
Durometer
Hardness(JIS
A
0
)
56
Volume
resistivity(
Ω·cm
)
7X10
14
Dielectric
breakdown
voltage(KV/mm)
≥20
Flammability
classification
UL-94
V-0
Shrinkage
%
0.01
Thermal
expansion
properties of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
The
coefficient
of
thermal
expansion
ranging
of
silicone
compound
is
5.9-7.9
x
10-4/°C.
The
coefficient
of
linear
thermal
expansion
is
about
1/3
of
the
coefficient
of
volume
thermal
expansion;
it
can
be
used
for
the
overall
linear
thermal
expansion
calculation
of
rubber
parts
under
a
certain
limits
of
temperature.
Curing
time of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
The
following
cure
schedules
may
be
used
as
a
guideline;
however,
larger
masses
may
require
longer
periods
of
time
to
reach
temperature.
24
hours
at
23-25℃
4-6
hours
at
50℃
1-2
hours
at
100℃
Faster
if
needed
25-30
mins
at
60℃
18
mins
at
70℃
5
mins
at
80℃
Using
Instructions of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
Silicone
compound
part
A
and
Part
B
should
be
thoroughly
mixed
at
a
1:1
ratio
(weight
or
volume)
before
using.
Pour
into
the
electronic
components
after
vacuum
de-airing.
Silicone
compound
may
be
cured
at
room
temperature
or
accelerated
with
heat.
Precautionsof
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
1.
The
curing
time
varies
due
to
different
temperature,
the
higher
temperature,
it
cures
faster.
Users
can
adjust
the
ratio
of
catalyst
according
to
the
temperature
in
order
to
get
an
ideal
curing
speed.
2.
Certain
materials
can
inhibit
the
cure
of
Silicone
rubber.
The
most
notable
include:
sulfur,
polysulfide,
sulfur-containing
material,
Organ
tin
and
organ
metallic
compound,
etc.
3.
Prevent
from
contact
with
tin,
phosphorus,
water,
ammonium,
chlorine,
carboxylic
acid,
hydroxyl
compound,
etc.
to
avoid
un-curing
circumstance.
Packing
and
Storage of
RTV
2
Silicone
Potting
Compound
Silicone
Encapsulant
For
Electronic
Components
MCSIL-E160
1.
Silicone
rubber
is
shipped
as
kits
that
Part
A
and
B
liquid
components
in
separate
containers.
It
is
available
in
packing
in
5kg
or
20kg
per
pail.
2.
Silicone
rubber
must
be
tightly
sealed
in
cool
and
dry
place,
prevented
from
sun
and
rain.
Transport
by
non-dangerous
goods.